Coating compositions

ABSTRACT

A curable resin composition including (I) at least one thermoset resin composition; and (II) at least one hardener; wherein the powder coating has a balance of properties including a combination of high glass transition temperature and low water absorption.

CROSS REFERENCE STATEMENT

This application is a Continuation Application of U.S. National Stageapplication Ser. No. 13/512,657, filed May 30, 2012 and published as US2012-0238668 on Sep. 20, 2012, which claims benefit to InternationalApplication Number PCT/US2010/056105, filed Nov. 10, 2010 and publishedas WO 2011/068645 on Jun. 9, 2011, which claims priority to U.S.Provisional Application 61/265,806 filed Dec. 2, 2009, the entirecontents of which are incorporated herein by reference in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to thermosettable coating compositions,and more specifically, the present invention relates to thermosettablecompositions for powder coatings and the powder coatings made from thethermosettable compositions.

2. Description of Background and Related Art

Thermoset resins, such as epoxy resins (epoxies), having good thermalresistant properties, are desirable for many applications such as liquidcoatings, powder coatings, and castings. Glycidyl ethers of aromaticdiphenols are a class of epoxy resins that are commonly used, and thereare many that are commercially available. Three desirable properties forthese aryl glycidyl ethers are high glass transition temperature (Tggreater than 190° C. by dynamic mechanical thermal analysis withdicyandiamide cure), low monomer viscosity (less than 200 mPa-s at 150°C.), and high epoxy equivalent weight (EEW). Epoxies of the presentinvention exhibit viscosities as low as 120 mPa-s and thedicyandiamide-cured thermosets have Tgs up to 202° C. and EEWs ofgreater than 190 grams/equivalent (g/eq).

High Tgs are needed for applications where the coating will be exposedto high temperature, for example to coat steel pipe used fortransporting hot oil. The properties of the coating degradeprecipitously above the temperature of the Tg. Low viscosity resins makeit easier to prepare smooth coatings that are free from defects, such aspinholes. Also, adhesion usually is better for low viscosity coatingsbecause wetting of the complex microstructure of the substrate isbetter. Finally, epoxy resins with high EEWs give thermosets with arelatively low concentration of hydroxyls in the backbone. Hydroxyls areformed during typically curing reactions of epoxy resins, such as withdicyandiamide, a multifunctional amine. There is a direct relationshipbetween hydroxyl concentration in a thermoset and water absorption. Highwater absorption is undesirable in coatings because corrosion rates aretypically higher and longevity in wet or humid environments suffers.

There are many aryl glycidyl ethers that achieve these propertiesindividually, but not that meet them all properties simultaneously. Thisbalance of properties is difficult to achieve. For example, one commonstrategy for high Tg is to use polyglycidyl ethers of highly functionalpolyphenols, especially phenol formaldehyde novolacs which are known asepoxy novolacs. However, examples of such novolacs having viscosities ofless than about 200 mPa-s are not capable of achieving high Tgs. Forexample, D.E.N.™ 438 (trademark of The Dow Chemical Company), anindustry standard epoxy novolac, has a viscosity of <200 mPa-s but theTg of the dicyandiamide-cured thermoset is only 173° C.

Accordingly, there is still a need in the coating industry to developnew thermoset resins useful for coatings that are derived fromdifunctional resins with a balance of properties including high Tg(>190° C.), low monomer viscosity (<150 mPa-s at 150° C.) and high EEW(>190 g/eq).

SUMMARY OF THE INVENTION

The present invention provides a solution to the problems of the coatingindustry. The present invention is directed to a curable resincomposition for coatings comprising (I) at least one thermoset resincomposition; and (II) at least one curing agent. This composition canoptionally include catalysts, co-catalysts, additional thermoset resinsdifferent from component (I), fillers, pigments, flow aids, and othermodifiers; wherein the coatings are derived from an epoxy resin thatexhibits a balance of desirable properties including a combination ofhigh glass transition temperature (>190° C. when cured withdicyandiamide), low monomer viscosity (<150 mPa-s at 150° C.) and highEEW (>190 g/eq).

Another embodiment of the present invention is directed to a process formaking the above curable composition.

Yet another aspect of the present invention is directed to powdercoatings, i.e., thermoset products (cured resin products) made from theabove curable resin composition.

DETAILED DESCRIPTION OF THE INVENTION

According to the present invention, a curable resin composition (alsoreferred to herein as a thermosettable composition or hardenablecomposition), useful for powder coatings of the present inventiondisclosed herein, may comprise (I) at least one thermoset resincomposition; and (II) at least one curing agent. This composition canoptionally include catalysts, co-catalysts, additional thermoset resinsdifferent from component (I), fillers, pigments, flow aids, and othermodifiers; wherein the coating has a combination of high glasstransition temperature and low water absorption.

The term “curable” means that the composition is capable of beingsubjected to conditions which will render the composition to a cured orthermoset state or condition.

The term “cured” or “thermoset” is defined by L. R. Whittington inWhittington's Dictionary of Plastics (1968) on page 239 as follows:“Resin or plastics compounds which in their final state as finishedarticles are substantially infusible and insoluble. Thermosetting resinsare often liquid at some stage in their manufacture or processing, whichare cured by heat, catalysis, or some other chemical means. After beingfully cured, thermosets cannot be resoftened by heat. Some plasticswhich are normally thermoplastic can be made thermosetting by means ofcrosslinking with other materials.”

As non-limiting embodiments of the present invention, the thermosetresin composition, component (I), of the thermosettable composition ofthe present invention may be selected, for example, from the following:

(1) An epoxy resin represented by Formula I which is prepared from adihydroxydiphenyl-cycloalkane compound:

wherein R^(a) is a hydrogen or methyl group; R¹ and R², independentlyfrom each other, each represents a hydrogen atom, a halogen, asubstituted or unsubstituted alkyl group, a substituted or unsubstitutedaryl group, or a substituted or unsubstituted aralkyl group; a nitrilegroup; a nitro group; a substituted or unsubstituted alkoxy group; X isCH₂, CH(R³), or C(R³)(R⁴); m is an integral number between 8 and 20; R³and R⁴, independently from each other, each represents a hydrogen atom,a halogen, a substituted or unsubstituted alkyl group, a substituted orunsubstituted aryl group, or a substituted or unsubstituted aralkylgroup; and n is an integer having a value from 0 to about 10.

In the Formula I above, the substituted or unsubstituted alkyl group, asubstituted or unsubstituted aryl group, or a substituted orunsubstituted aralkyl group for R¹-R⁴ and the substituted orunsubstituted alkoxy group for R¹ and R² may include, for example, aC₁-C₈ alkyl or alkyloxy group, a C₆-C₁₀ aryl group, or a C₇-C₁₂ aralkylgroup.

As typically prepared the epoxy resins of Formula I are a mixture ofoligomers with varying “n” that can be adjusted depending on the processconditions. When low melt viscosity is desired, conditions are chosen togive a mixture in which the shortest member with n=0 predominates (>70wt %).

(2) An advanced epoxy resin composition represented in Formula II, suchthose which are prepared by reacting one or more bisphenols with astoichiometric excess of one or more of the epoxy resins of Formula I:

wherein R¹, R², R³, R⁴, R^(a), X, and m are as defined in Formula I, yis an integer having a value from 1 to about 20; p is an integer havinga value of 1 to about 20; Q is a hydrocarbylene moiety, and each Z isindependently selected from the group consisting of O, S, —NR^(b),wherein R^(b) is a hydrocarbyl moiety.

By “hydrocarbylene moiety” as used herein it is meant any divalentradical formed by removing two hydrogen atoms from a hydrocarbon. Morespecifically the hydrocarbylene moiety is a divalent moiety selectedfrom the group consisting of an unsubstituted or substituted alkyl, anunsubstituted or substituted cycloalkyl, an unsubstituted or substitutedpolycycloalkyl, an unsubstituted or substituted alkenyl, anunsubstituted or substituted cycloalkenyl, an unsubstituted orsubstituted di or polycycloalkenyl, or an unsubstituted or substitutedaromatic ring. By “hydrocarbyl moiety” used herein it is meant amonovalent radical, more specifically, any monovalent moiety selectedfrom the group consisting of an unsubstituted or substituted alkyl, anunsubstituted or substituted cycloalkyl, an unsubstituted or substitutedpolycycloalkyl, an unsubstituted or substituted alkenyl, anunsubstituted or substituted cycloalkenyl, an unsubstituted orsubstituted di or polycycloalkenyl, or an unsubstituted or substitutedaromatic ring.

The epoxy resin of Formula II is an advanced epoxy resin productprepared from (a) one or more epoxy resins of adihydroxydiphenyl-cycloalkane compound given in Formula I with (b) oneor more suitable compounds having an average of more than one reactivehydrogen atom per molecule, wherein the reactive hydrogen atom isreactive with an epoxide group in said epoxy resin. The epoxy resin usedin the advancement reaction may additionally include (c) any one or moreepoxy resins known in the art different from component (a), such as, forexample, diglycidyl ethers of dihydroxyaromatic compounds. Thepreparation of the aforementioned advanced epoxy resin products can beperformed using known methods.

Examples of the compound having an average of more than one reactivehydrogen atom per molecule include dihydroxyaromatic, dithiol,disulfonamide, diamide or dicarboxylic acid compounds or compoundscontaining one primary amine or amide group, two secondary amine groups,one secondary amine group and one phenolic hydroxy group, one secondaryamine group and one carboxylic acid group, or one phenolic hydroxy groupand one carboxylic acid group, and any combination thereof.

The ratio of the compound having an average of more than one reactivehydrogen atom per molecule to the epoxy resin is generally from about0.01:1 to about 0.95:1, preferably from about 0.05:1 to about 0.8:1, andmore preferably from about 0.10:1 to about 0.5:1 equivalents of thereactive hydrogen atom per equivalent of the epoxide group in the epoxyresin.

The advancement reaction may be conducted in the presence or absence ofa solvent with the application of heat and mixing. The advancementreaction may be conducted at atmospheric, superatmospheric orsubatmospheric pressures and at temperatures of from about 20° C. toabout 260° C., preferably, from about 80° C. to about 240° C., and morepreferably from about 100° C. to about 200° C.

The time required to complete the advancement reaction depends uponfactors such as the temperature employed, the chemical structure of thecompound having more than one reactive hydrogen atom per moleculeemployed, and the chemical structure of the epoxy resin employed. Highertemperature may require shorter reaction time whereas lower temperaturemay require a longer period of the reaction time.

In general, the time for the advancement reaction completion may rangefrom about 5 minutes to about 24 hours, preferably from about 30 minutesto about 8 hours, and more preferably from about 30 minutes to about 4hours.

A catalyst may also be added in the advancement reaction. Examples ofthe catalyst may include phosphines, quaternary ammonium compounds,phosphonium compounds, tertiary amines, and mixtures thereof. Thecatalyst may be employed in quantities from about 0.01 to about 3,preferably from about 0.03 to about 1.5, and more preferably from about0.05 to about 1.5 percent by weight based upon the total weight of theepoxy resin.

Other details concerning an advancement reaction useful in preparing theadvanced epoxy resin product for the resin compound which may beemployed in the present invention are given in U.S. Pat. No. 5,736,620and Handbook of Epoxy Resins by Henry Lee and Kris Neville, incorporatedherein by reference.

Examples of the aromatic di and polyhydroxyl containing compound includethe dihydroxydiphenyl-cycloalkanes derived from the reaction with ofcyclooctanone, cyclodecanone, cyclododecanone, cyclopentadecanone,cyclooctadecanone, cycloeicosanone, and mixtures thereof with phenol;hydroquinone; resorcinol; catechol; 2,4-dimethylresorcinol;4-chlororesorcinol; tetramethylhydroquinone; bisphenol A(4,4′-isopropylidenediphenol); 4,4′-dihydroxydiphenylmethane;4,4′-thiodiphenol; 4,4′-sulfonyldiphenol; 2,2′-sulfonyldiphenol;4,4′-dihydroxydiphenyl oxide; 4,4′-dihydroxybenzophenone;1,1-bis(4-hydroxyphenyl)-1-phenylethane;4,4′-bis(4(4-hydroxyphenoxy)-phenylsulfone)diphenyl ether;4,4′-dihydroxydiphenyl disulfide;3,3′,3,5′-tetrachloro-4,4′-isopropylidenediphenol;3,3′,3,5′-tetrabromo-4,4′-isopropylidenediphenol;3,3′-dimethoxy-4,4′-isopropylidenediphenol; 4,4′-dihydroxybiphenyl;4,4′-dihydroxy-alpha-methylstilbene; 4,4′-dihydroxybenzanilide;bis(4-hydroxyphenyl)terephthalate;N,N′-bis(4-hydroxyphenyl)terephthalamide;bis(4′-hydroxybiphenyl)terephthalate; 4,4′-dihydroxyphenylbenzoate;bis(4′-hydroxyphenyl)-1,4-benzenediimine;1,1′-bis(4-hydroxyphenyl)cyclohexane; phloroglucinol; pyrogallol;2,2′,5,5′-tetrahydroxydiphenylsulfone; tris(hydroxyphenyl)methane;dicyclopentadiene diphenol; tricyclopentadienediphenol; and anycombination thereof.

Examples of the di- and polycarboxylic acids include4,4′-dicarboxydiphenyl-methane; terephthalic acid; isophthalic acid;1,4-cyclohexanedicarboxylic acid; 1,6-hexanedicarboxylic acid;1,4-butanedicarboxylic acid; dicyclopentadienedicarboxylic acid;tris(carboxyphenyl)methane; 1,1-bis(4-carboxyphenyl)cyclohexane;3,3′,5,5′-tetramethyl-4,4′-dicarboxydiphenyl;4,4′-dicarboxy-alpha-methylstilbene;1,4-bis(4-carboxyphenyl)-trans-cyclohexane;1,1′-bis(4-carboxyphenyl)cyclohexane; 1,3-dicarboxy-4-methylbenzene;1,3-dicarboxy-4-methoxybenzene; 1,3-dicarboxy-4-bromobenzene;4,4′-benzanilidedicarboxylic acid; 4,4′-phenylbenzoatedicarboxylic acid;4,4′-stilbenedicarboxylic acid; and any combination thereof.

Examples of the di- and polymercaptans include 1,3-benzenedithiol;1,4-benzenedithiol; 4,4′-dimercaptodiphenylmethane;4,4′-dimercaptodiphenyl oxide; 4,4′-dimercapto-alpha-methylstilbene;3,3′,5,5′-tetramethyl-4,4′-dimercaptodiphenyl; 1,4-cyclohexanedithiol;1,6-hexanedithiol; 2,2′-dimercaptodiethylether; 1,2-dimercaptopropane;bis(2-mercaptoethyl) sulfide; tris(mercaptophenyl)methane;1,1-bis(4-mercaptophenyl)cyclohexane; and any combination thereof.

Examples of the di- and polyamines include 1,2-diaminobenzene;1,3-diaminobenzene; 1,4-diaminobenzene; 4,4′-diaminodiphenylmethane;4,4′-diaminodiphenylsulfone; 2,2′-diaminodiphenylsulfone;4,4′-diaminodiphenyl oxide; 3,3′,5,5′-tetramethyl-4,4′-diaminodiphenyl;3,3′-dimethyl-4,4′-diaminodiphenyl; 4,4′-diamino-alpha-methylstilbene;4,4′-diaminobenzanilide; 4,4′-diaminostilbene;1,4-bis(4-aminophenyl)-trans-cyclohexane;1,1-bis(4-aminophenyl)cyclohexane; tris(aminophenyl)methane;1,4-cyclohexanediamine; 1,6-hexanediamine; piperazine; ethylenediamine;diethylenetriamine; triethylenetetramine; tetraethylenepentamine;1-(2-aminoethyl)piperazine; bis(aminopropyl)ether;bis(amino-propyl)sulfide; bis(aminomethyl)norbornane;2,2′-bis(4-aminocyclohexyl)propane; and any combination thereof.

Examples of the primary monoamines include aniline, 4-chloroaniline,4-methylaniline, 4-methoxyaniline, 4-cyanoaniline, 4-aminodiphenyloxide, 4-aminodiphenylmethane, 4-aminodiphenyl sulfide,4-aminobenzophenone, 4-aminodiphenyl, 4-aminostilbene,4-amino-alpha-methylstilbene, methylamine, 4-amino-4′-nitrostilbene,n-hexylamine, cyclohexylamine, aminonorbornane, 2,6-dimethylaniline, andany combination thereof.

Examples of the sulfonamides include phenylsulfonamide,4-methoxyphenyl-sulfonamide, 4-chlorophenylsulfonamide,4-bromophenylsulfonamide, 4-methyl-sulfonamide, 4-cyanosulfonamide,4-sulfonamidodiphenyl oxide, 4-sulfonamido-diphenylmethane,4-sulfonamidobenzophenone, 4-sulfonylamidodiphenyl,4-sulfon-amidostilbene, 4-sulfonamido-alpha-methylstilbene,2,6-dimethyphenylsulfonamide and any combination thereof.

Examples of the aminophenols include o-aminophenol, m-aminophenol,p-aminophenol, 2-methoxy-4-hydroxyaniline,3-cyclohexyl-4-hydroxyaniline, 2,6-dibromo-4-hydroxyaniline,5-butyl-4-hydroxyaniline, 3-phenyl-4-hydroxyaniline,4-(1-(3-aminophenyl)-1-methylethyl)phenol,4-(1-(4-aminophenyl)ethyl)phenol, 4-(4-aminophenoxyl)phenol,4-((4-aminophenyl)thio)phenol,(4-aminophenyl)(4-hydroxy-phenyl)methanone, 4-((4-aminophenyl)sulfonyl)phenol,4-(1-(4-amino-3,5-dibromophenyl)-1-methylethyl)-2,6-dibromophenol,N-methyl-p-aminophenol, 4-amino-4′-hydroxy-alpha-methylstilbene,4-hydroxy-4′-amino-alpha-methylstilbene, 3,5-dimethyl-4-hydroxyaniline,and any combination thereof.

Examples of the aminocarboxylic acids include 2-aminobenzoic acid,3-aminobenzoic acid, 4-aminobenzoic acid, 2-methoxy-4-aminobenzoic acid,3-cyclohexyl-4-aminobenzoic acid, 2,6-dibromo-4-aminobenzoic acid,5-butyl-4-aminobenzoic acid, 3-phenyl-4-aminobenzoic acid,4-(1-(3-aminophenyl)-1-methylethyl)benzoic acid,4-(1-(4-aminophenyl)ethyl)benzoic acid, 4-(4-aminophenoxyl)benzoic acid,4-((4-aminophenyl)thio)benzoic acid,(4-aminophenyl)(4-carboxyphenyl)methanone, 4-((4-aminophenyl)sulfonyl)benzoic acid,4-(1-(4-amino-3,5-dibromophenyl)-1-methylethyl)-2,6-dibromobenzoic acid,N-methyl-4-aminobenzoic acid, 4-amino-4′-carboxy-alpha-methylstilbene,4-carboxy-4′-amino-alpha-methylstilbene, glycine, N-methylglycine,4-aminocyclohexanecarboxylic acid, 4-aminohexanoic acid,4-piperidinecarboxylic acid, 5-aminophthalic acid,3,5-dimethyl-4-aminobenzoic acid, and any combination thereof.

Examples of the sulfanilamides include o-sulfanilamide, m-sulfanilamide,p-sulfanilamide, 2-methoxy-4-aminobenzoic acid,3-methyl-4-sulfonamido-1-aminobenzene,5-methyl-3-sulfonamido-1-aminobenzene,3-phenyl-4-sulfonamido-1-aminobenzene,4-(1-(3-sulfonamidophenyl)-1-methylethyl)aniline,4-(1-(4-sulfonamido-phenyl)ethyl)aniline,4-(4-sulfonamidophenoxy)aniline, 4-((4-sulfonamido-phenyl)thio)aniline,(4-sulfonamidophenyl)(4-aminophenyl)methanone,4-((4-sulfon-amidophenyl)sulfonyl)aniline,4-(1-(4-sulfonamido-3,5-dibromophenyl)-1-methylethyl)-2,6-dibromoaniline,4-sulfonamido-1-N-methylaminobenzene,4-amino-4′-sulfonamido-alpha-methylstilbene,4-sulfonamido-4′-amino-alpha-methylstilbene,2,6-dimethyl-4-sulfonamido-1-aminobenzene, and any combination thereof.

(3) An advanced active hydrogen-containing resin composition representedin Formula III, which is prepared by reacting one or more bisphenolswith a stoichiometric deficiency of one or more of the epoxy resins ofFormula I:

wherein R¹, R², R³, R⁴, R^(a), X, Z, p, and m are as defined in FormulaI, y¹ is an integer having a value from 0 to about 20; Q is ahydrocarbylene moiety; and Z¹ is Z—H.

The terms “hydrocarbylene moiety” and “hydrocarbyl moiety” are used ashereinbefore defined.

Any one of the thermoset resin compositions described above which canserve as component (I) of the thermosettable composition of the presentinvention, can include any of the thermoset resin compositions describedin co-pending U.S. Patent Application Ser. No. 61/265,799, filed on evendate herewith by Metral et al., incorporated herein by reference. Themethod of manufacturing component (I) is also described in the aboveco-pending U.S. Patent Application Ser. No. 61/265,799.

In general, the powder coating composition of the present invention maycomprise a thermoset component (I), in an amount of from about 20 wt %to about 98 wt %; preferably, from about 30 wt % to about 96 wt %; andmore preferably, from about 50 wt % to about 96 wt % based on the totalweight of the powder coating composition.

Component (I) may be cured in accordance with well known techniques usedby those skilled in the art of curing conventional thermoset resins suchas epoxy resins, including for example, mixing a curing agent, component(II) with component (I) in the appropriate ratio; and subjecting thethermosettable composition comprising the mixture of components (I) and(II) to curing conditions.

The curing agent, component (II), (also referred to as a hardener orcross-linking agent) useful in the thermosettable composition, may beselected, for example, from those curing agents well known in the artincluding, but are not limited to, anhydrides, carboxylic acids, aminecompounds, phenolic compounds, polyols, or mixtures thereof.

Examples of the curing agent useful in the present invention include anyof the curing materials known to be useful for curing epoxy resin basedcompositions. Such materials include, for example, polyamine, polyamide,polyaminoamide, polyphenol, polymeric thiol, polycarboxylic acid andanhydride, polyol, and any combination thereof or the like. Otherspecific examples of the curing agent include dicyandiamide, phenolnovolacs, bisphenol-A novolacs, phenol novolacs of dicyclopentadiene,styrene-maleic acid anhydride (SMA) copolymers; and any combinationthereof. Preferred examples of the curing agent may include a phenolnovolac, a cresol novolac, bisphenol A, dicyandiamide, and anycombination thereof.

Dicyandiamide (“dicy”) may be one preferred embodiment of the curingagent useful in the present invention. Dicy has the advantage ofproviding delayed curing since dicy requires relatively hightemperatures for activating its curing properties; and thus, dicy can beadded to a thermosetting resin and stored at room temperature (about 25°C.). Additionally, the curing profile of a resin composition using dicymay be conveniently modified using a catalyst, such as, for example,2-methylimidazole (2-MI).

In general, the concentration of the curing agent or hardener, component(II), present in the thermosettable resin composition of the presentinvention may vary depending on the end use application. For example,the amount of curing agent used may vary from about 0.1 to about 150parts per hundred parts thermosettable resin, by weight, in someembodiments. In other embodiments, the curing agent may be used in anamount ranging from about 5 to about 95 parts per hundred partsthermosettable resin, by weight; and the curing agent may be used in anamount ranging from about 10 to about 90 parts per hundred partstheremosettable resin, by weight, in yet other embodiments.

In another embodiment of the present invention, component (I) may becured in accordance with well known techniques used by those skilled inthe art of curing conventional epoxy resins, including for example,mixing component (I) as described above with another thermosetting resincomponent (III) in the appropriate ratio; and subjecting thethermosettable composition comprising the mixture of components (I) and(III) to curing conditions. In this embodiment, the curing agent orhardener (II) may be optional, particularly in the instance wherein thecomponent (III) contains reactive functionalities that can react withthe thermosetting resin without the use of a curing agent. The optionalcuring agent may be any of the curing agents (II) described above.

The other thermosetting resin component (III) useful for the powdercoating composition, may include, for example, at least one thermosetresin component selected from epoxy resins, isocyanate resins,(meth)acrylic resins, phenolic resins, vinylic resins, styrenic resins,polyester resins, vinylester resins, silicone resins, melamine resins;and mixtures thereof. Preferably, an epoxy resin is employed ascomponent (III) which is different from component (I) in thethermosettable resin composition.

Examples of the other thermoset resin different from component (I),suitable for use in the present invention may include epoxidizedbisphenol A; epoxidized phenolic novolac, such as epoxidized phenolnovolac, bisphenol A novolac, or epoxidized bisphenol dicyclopentadienenovolac; epoxidized bromine-containing bisphenol A or brominatedbisphenol A novolac; epoxidized phosphorus-containing bisphenol A; orany combination thereof.

The other thermosetting resin, component (III), may be present in thethermosettable composition at a concentration ranging generally fromabout 0 weight percent (wt %) to about 80 wt %, preferably from about 0wt % to about 50 wt %, and more preferably from about 0 wt % to about 40wt %.

In one preferred embodiment, the other thermosetting resin useful ascomponent (III), in the present invention includes at least one epoxyresin. The term “epoxy resin” herein means a compound which possessesone or more vicinal epoxy groups per molecule, i.e., at least one1,2-epoxy group per molecule. In general, the epoxy resin compound maybe a saturated or unsaturated aliphatic, cycloaliphatic, aromatic orheterocyclic compound which possesses at least one 1,2-epoxy group. Suchcompounds can be substituted, if desired, with one or morenon-interfering substituents, such as halogen atoms, aliphatic orcycloaliphatic hydroxy groups, ether radicals, lower alkyls and thelike. The epoxy resin compound may also be monomeric, oligomeric orpolymeric, i.e., the epoxy resin may be selected from a monoepoxide, adiepoxide, a multi-functional epoxy resin, a polyepoxide; an advancedepoxy resin; or mixtures thereof. An extensive enumeration of epoxyresins useful in the present invention is found in Lee, H. and Neville,K., “Handbook of Epoxy Resins,” McGraw-Hill Book Company, New York,1967, Chapter 2, pages 257-307; incorporated herein by reference.

The epoxy resins useful in the present invention may vary and includeconventional and commercially available epoxy resins, which may be usedalone or in combinations of two or more. In choosing epoxy resins forcompositions disclosed herein, consideration should not only be given toproperties of the final product, but also to viscosity and otherproperties that may influence the processing of the resin composition.

Particularly suitable epoxy resins known to the skilled worker are basedon reaction products of polyfunctional alcohols, phenols, cycloaliphaticcarboxylic acids, aromatic amines, or aminophenols with epichlorohydrin.A few non-limiting embodiments include, for example, bisphenol Adiglycidyl ether, bisphenol F diglycidyl ether, resorcinol diglycidylether, and the triglycidyl ether of para-aminophenol. Other suitableepoxy resins known to the skilled worker include reaction products ofepichlorohydrin with o-cresol and, respectively, phenol novolacs. It isalso possible to use a mixture of two or more of any of the above epoxyresins.

The epoxy resins useful in the present invention for the preparation ofthe thermoset composition, component (III), may be selected fromcommercially available products. For example, D.E.R.™ 331, D.E.R.™ 332,D.E.R.™ 334, D.E.R.™ 580, D.E.N.™ 431, D.E.N.™ 438, D.E.R.™ 736, orD.E.R.™ 732 available from The Dow Chemical Company may be used. As anillustration of the present invention, the epoxy resin component of thepresent invention may be a liquid epoxy resin, D.E.R.™383 (DGEBPA)having an epoxide equivalent weight of 175-185, a viscosity of 9.5 Pa-sand a density of 1.16 gm./cc. Other commercial epoxy resins that can beused for the epoxy resin component can be D.E.R.™ 330, D.E.R.™ 354, orD.E.R.™ 332. D.E.R is a trademark of The Dow Chemical Company.

Other suitable epoxy resins useful in the present invention aredisclosed in, for example, U.S. Pat. Nos. 3,018,262; 7,163,973,6,887,574; 6,632,893; 6,242,083; 7,037,958; 6,572,971; 6,153,719;5,405,688; PCT Publication WO 2006/052727; U.S. Patent ApplicationPublication Nos. 20060293172 and 20050171237, each of which isincorporated herein by reference.

The EEW of the epoxy resins useful in the present invention is generallyfrom about 100 g/eq to about 20,000 g/eq and more preferably from about150 to about 5000 g/eq. As used herein the terms “epoxide equivalentweight” refers to the number average molecular weight of the epoxidemoiety in grams per equivalent (g/eq) divided by the average number ofepoxide groups present in the molecule. Examples of diepoxides useful inthe present invention are the epoxy resins having an EEW of from about100 g/eq to about 4000 g/eq.

Other epoxy resins useful as the at least one thermoset resin ofcomponent (III), include; an epoxidized phenol novolac; abromine-containing epoxy resin; a phosphorous-containing epoxy resin;and combinations thereof.

More specific embodiments of the epoxy resins useful in the presentinvention may include for example; an epoxidized bisphenol A novolac; anepoxidized phenol dicyclopentadiene novolac; an epoxidizedbromine-containing bisphenol A novolac; or any combination thereof.

In general, in one embodiment, component (III) may be present in thecurable composition in an amount of from about 0 wt % to about 80 wt %;preferably, from about 0 wt % to about 60 wt %; and more preferably,from about 0 wt % to about 50 wt % based on the total weight of thecomposition.

The composition of the present invention optionally contains a filler.The type and amount of filler may vary depending on the type and amountof other components. The fillers used herein may include, for example,silica, talc, alumina, quartz, mica, flame retardants, metallic powders,and any combination thereof. Examples of flame retardant fillers mayinclude aluminum trihydroxide, magnesium hydroxide, phosphinites such asaluminum or zinc phosphinites, or boehmite.

In general, the amount of filler that may be present in the thermosetresin is from about 0 percent to about 95 percent by weight, preferably,from about 2 percent to about 90 percent by weight, more preferably,from about 5 percent to about 85 percent by weight, even morepreferably, from about 10 percent to about 80 percent by weight, andmost preferably, from about 15 percent to about 75 percent by weightbased on the total weight of the thermoset resin.

The inorganic filler is generally in a particle form and has an averageparticle dimension below about 1 mm, preferably below about 100 micron,more preferably below about 50 micron, and most preferably below about10 micron, and above about 2 nm, preferably above about 10 nm, morepreferably above about 20 nm, and most preferably above about 50 nm.

The thermosettable powder coating composition of the present inventionmay further comprise one or more optional added components such as, forexample, a catalyst or a solvent.

An optional component useful in the thermosettable composition of thepresent invention includes at least one catalyst. The catalyst used inthe present invention may be adapted for polymerization, includinghomopolymerization, of the at least one thermosetting resin.Alternatively, catalyst used in the present invention may be adapted fora reaction between the at least one thermosetting resin and the at leastone curing agent.

The catalyst useful as an optional component in the thermosettablecomposition of the present invention may be any catalyst well known inthe art used for this purpose. For example, the catalyst may includecompounds containing amine, phosphine, heterocyclic nitrogen, ammonium,phosphonium, sulfonium moieties, a substituted derivative thereof, andany combination thereof. Some non-limiting examples of the catalystuseful in the present invention may include, for example,ethyltriphenylphosphonium chloride; benzyltrimethylammonium chloride;heterocyclic nitrogen-containing catalysts described in U.S. Pat. No.4,925,901, incorporated herein by reference; imidazoles; triethylamine;and any combination thereof.

The selection of the catalyst useful in the present invention is notlimited and commonly used catalysts for epoxy systems can be used. Also,the addition of a catalyst is optional and depends on the systemprepared. When the catalyst is used, preferred examples of catalystinclude tertiary amines, imidazoles, organophosphines, and acid salts.

Most preferred catalysts include tertiary amines such as, for example,triethylamine, tripropylamine, tributylamine, 2-methylimidazole,benzyldimethylamine, mixtures thereof and the like. Especially preferredare the alkyl-substituted imidazoles; 2,5-chloro-4-ethyl imidazole; andphenyl-substituted imidazoles, and any mixture thereof.

Even more preferred embodiments of the catalyst suitable for the presentinvention include for example 2-methyl imidazole, 2-phenyl imidazole,1,8-diazabicyclo[5.4.0]undec-7-ene (DBU), imidazole derivatives such as2-methyl imidazole-epoxy resin adduct, such as EPON™ P101 (availablefrom Hexion Specialty Chemicals), and any combination thereof.

In general, the concentration of the catalyst present in thethermosettable resin composition of the present invention may varydepending on the end use application. The amount of catalyst used mayvary from about 0.1 to about 20 parts per hundred parts thermosettableresin, by weight, in some embodiments. In other embodiments, catalystmay be used in an amount ranging from about 1 to about 15 parts perhundred parts thermosettable resin, by weight; and from about 2 to about10 parts per hundred parts thermosettable resin, by weight, in yet otherembodiments. The specific amount of catalyst used for a given system maybe determined experimentally through simple range finding experiments todevelop the optimum in properties desired.

Examples of solvents useful for the thermosettable powder coatingcomposition of the present invention may include glycol ethers such asthose commercially available as the Dowanol™ P series from the DowChemical Company, or ketones such as acetone or methyl ethyl ketone(MEK).

In general, the thermosettable powder coating composition of the presentinvention may comprise a solvent component in an amount of from about 0wt % to about 20 wt %; preferably, from about 0 wt % to about 10 wt %;and more preferably, from about 0 wt % to about 5 wt % based on thetotal weight of the composition.

An optional component useful in the thermosettable composition of thepresent invention includes at least one chain extender. Examples of thechain extender useful as an additive in the composition of the presentinvention may include a dihydroxydiphenyl-cycloalkane such as bisphenolcyclododecanone, bisphenol A; dicyandiamide; a phenol novolac such as abisphenol A novolac or phenol dicyclopentadiene novolac;bromine-containing bisphenol A such as tetrabromobisphenol A (TBBA);bromine-containing bisphenol A novolac; phosphorus-containing bisphenolA novolac; or any combination thereof.

In general, the additional optional curing agent (hardener or chainextender) used in the composition may be present in an amount of fromabout 0 wt % to about 50 wt %; preferably, from about 0 wt % to about 30wt %; and more preferably, from about 0 wt % to about 20 wt % based onthe total weight of the composition.

The thermosettable composition of the present invention may includeoptional additives and fillers conventionally found in thermosettableresin systems such as for example epoxy resin systems. The powdercoating composition of the present invention may optionally containother additives which are useful for their intended uses. For example,the additives may include stabilizers, surfactants and flow modifiers,fillers, pigments and matting agents. More specific examples of theadditives useful in the present invention include BaSO₄, TiO₂, Modaflow™Acronal 4F™, Byk 361™ (as a flow modifier), and benzoin as a degassingagent. The type and amount of the additives used in the thermosettableresin composition will depend on the intended use of the thermosettableresin composition.

For example, the optional additives useful in the present inventioncomposition may include, but are not limited to, silica, glass, talc,metal powders, titanium dioxide, wetting agents, pigments, coloringagents, mold release agents, toughening agents, coupling agents,degassing agents, flame retardants (e.g., inorganic flame retardants,halogenated flame retardants, and non-halogenated flame retardants suchas phosphorus-containing materials), ion scavengers, UV stabilizers,flexibilizing agents, tackifying agents, stabilizers, surfactants, flowmodifiers, fillers, pigments or dyes, gloss control agents,antioxidants, matting agents curing initiators, curing inhibitors,thermoplastics, processing aids, UV blocking compounds, fluorescentcompounds, UV stabilizers, inert fillers, fibrous reinforcements,antioxidants, impact modifiers including thermoplastic particles, andmixtures thereof. Additives and fillers may also include fumed silica,aggregates such as glass beads, polytetrafluoroethylene, polyol resins,polyester resins, phenolic resins, graphite, molybdenum disulfide,abrasive pigments, viscosity reducing agents, boron nitride, mica,nucleating agents, and stabilizers, among others. Fillers and modifiersmay be preheated to drive off moisture prior to addition to thethermosettable resin composition. Additionally, these optional additivesmay have an effect on the properties of the composition, before and/orafter curing, and should be taken into account when formulating thecomposition and the desired cured product. The above list is intended tobe exemplary and not limiting. The preferred additives for theformulation of the present invention may be optimized by the skilledartisan.

Preferably, the additives used in the present invention includecatalyst, co-catalysts, accelerators; and optionally otherapplication-specific additives such as flame retardants, wetting agents,defoamers, adhesion promoters, fillers, pigments, dyes, stabilizers,UV-absorbers, and toughening agents. As is known in the art, it ispossible to add other thermosetting monomers such as other epoxides,cyanates, maleimides, triazines, and benzoxazines, as well as otheroligomers or polymers such as poly(phenylene oxide).

The concentration of the additional additives is generally between about0 wt % to about 50 wt %, preferably between about 0.01 wt % to about 20wt %, more preferably between about 0.05 wt % to about 15 wt %, and mostpreferably between about 0.1 wt % to about 10 wt % based on the weightof the total composition. Below about 0.01 wt %, the additives generallydo not provide any further significant advantage to the resultantthermoset product; and above about 20 wt %, the property improvement(s)brought by these additives remains relatively constant.

Curable compositions may include from about 0.1 to about 50 volumepercent optional additives in some embodiments. In other embodiments,curable compositions may include from about 0.1 to about 5 volumepercent optional additives; and from about 0.5 to about 2.5 volumepercent optional additives in yet other embodiments.

Generally, curable compositions may be formed by admixing the abovecomponents in stages or simultaneously in the desired amounts to formthe curable composition. The components of the formulation orcomposition of the present invention may be admixed to provide thecurable composition of the present invention; and the final curableformulation of the present invention can be cured under conventionalprocessing conditions to form a thermoset.

Any of the well known processes for manufacturing the powder coatingcomposition may be used. For example, the components of the powdercoating composition of the present invention are typically pre-blendedor ground in a grinder, and the resulting ground powder mixture exitingfrom the grinder is then fed into an extruder.

In the extruder, the powder mixture is heated at low temperature andmelted into a semi-liquid form. During this process, the components ofthe molten mixture are thoroughly and uniformly dispersed. Because ofthe fast operation of the extruder and the relatively low temperaturewithin the extruder, the components of the powder coating composition ofthe present invention will not undergo a significant chemical reaction.The resulting molten extrudate of the powder coating composition of thepresent invention exiting from the extruder is then passed from theextruder onto a flaker which then feeds the flakes of the compositioninto a mill/classifier to obtain a powder coating final product with adesired particle size. The final powder coating product is then packagedin closed containers, using a packaging unit to avoid moistureingression into the product.

The apparatus for manufacturing the powder coating composition of thepresent invention such as the pre-blending station or grinder; theextruder, the flaker, the mill/classifier, and the packaging unit areall well known equipment in the art.

The powder coating composition of the present invention may be appliedto a substrate of an article by various methods. For example, in oneembodiment, the powder coating composition may be applied to a substrateby (1) heating the substrate to a suitable curing temperature for thecomposition; and (2) applying the powder coating composition by knownmeans such as an electrostatic spray or a fluidized bed. In anotherembodiment, the epoxy powder coating composition may be applied to acold substrate by (1) applying the epoxy powder coating composition tothe substrate (e.g. with an electrostatic application method); and (2)heating the powder and the substrate to a temperature at which thepowder flows and cures.

In some embodiments, powder coatings may be formed by applying athermosettable resin composition to a substrate and then curing thecurable thermosettable resin composition.

Curing of the thermosettable resin compositions disclosed herein usuallyrequires a temperature of at least about 30° C., up to about 250° C.,for periods of minutes up to hours, depending on the thermosettableresin used, the curing agent used, and the catalyst, if used. In otherembodiments, curing may occur at a temperature of at least 100° C., forperiods of minutes up to hours. Post-treatments may be used as well,such post-treatments ordinarily being at temperatures between about 100°C. and 200° C.

For example, the curing reaction of the thermosettable composition maybe conducted at a temperature, generally, between about 20° C. and about250° C., preferably between about 50° C. and about 200° C., morepreferably between about 50° C. and about 150° C. The time of curing thethermosettable resin composition may be for a predetermined period oftime which can range from minutes up to hours, generally the reactiontime is more than about 1 minute and less than about 24 hours,preferably between about 5 minutes and about 6 hours, and morepreferably between about 10 hours and about 2 hours. The curingconditions of the thermosettable resin can also depend on the componentsused, and any optional components added to the composition such as acatalyst, if used. In other embodiments, curing may occur at a firsttemperature followed by a second temperature or post-treatment, suchpost-treatments ordinarily being at temperatures above 100° C.,preferably between about 100° C. and 200° C.

Thermoset resins may be formed by curing the curable thermosettableresin compositions of the present invention as described above. Theresulting thermoset resins of the present invention may comprise athermoset or a thermoset network structure with fillers and/or otheradditives. The term “thermoset” or “thermoset network structure” usedherein refers to a substantially cured and crosslinked thermoset resinstructure.

The resulting powder coating of the present invention displays excellentthermo-mechanical properties, such as good toughness and mechanicalstrength, while maintaining high thermal stability.

It has been discovered in the present invention that thedihydroxydiphenyl-cycloalkane compounds of the present invention provideseveral improved properties to the thermoset resins of the presentinvention when compared to conventional phenolic curing agents and/orhardeners and/or chain extenders. For example, compared to conventionalthermoset resins, the thermoset resins of the present inventioncomprising the dihydroxydiphenyl-cycloalkane compounds of the presentinvention have the following improved properties while maintaining itsother properties such as high temperature stability and a highcross-linking density:

(1) an improved mechanical property such as improved toughness—based ondifunctional resins with low crosslink density and therefore relativelytough;

(2) an improved thermal property such as a higher glass transitiontemperatures of greater than about 150° C., preferably greater thanabout 170° C., and more preferably greater than about 190° C. and abovewhen cured with dicyandiamide;

(3) a higher humidity resistance property (a high moisture resistanceor, in other words, a low water uptake);

(4) a lower dielectric constant/dissipation factor (Dk/Df) property; and

(5) based on an epoxy resin that exhibits low viscosity of less thanabout 150 mPa-s and preferably less than about 120 mPa-s.

Without limiting the present invention to any one theory, it istheorized that the addition of the alkyl ring between the bisphenolgroups in the dihydoxydiphenyl-cycloalkane structure may reduce therotations of the bisphenol groups by steric hindrance and, as a result,the presence of the dihydoxydiphenyl-cycloalkane compound structureincreases the glass transition temperatures (Tg) of the host resinscompared to conventional resins which comprise bisphenol derivativeswithout the alkyl ring.

The increase of the glass transition temperatures of a host resincomprising the dihydroxydiphenyl-cycloalkane compounds of the presentinvention is generally in the range of from about 10° C. to about 100°C. or higher depending on factors such as type of curing agent(hardener), resin, and catalyst used in curing the resins; and thecuring conditions. The Young's moduli of a host resin comprisingdihydroxydiphenyl-cycloalkane compounds is also found to be lowercompared to resins comprising bisphenol derivatives without the alkylring. Thus, the compositions of the present invention exhibit a higherTg. It is theorized, that the addition of the alkyl ring between thebisphenol groups in the dihydroxydiphenyl-cycloalkane compounds maylower the cross-linking density due to higher steric hinderance andthus, provides improved toughness to thermosettable resins such as epoxyresins.

EXAMPLES

The following examples and comparative examples further illustrate thepresent invention in detail but are not to be construed to limit thescope thereof.

Various terms and designations used in the following examples areexplained herein as follows: D.E.R.™ 330 is a diglycidyl ether ofbisphenol A having an epoxy equivalent weight (EEW) between 177 g/eq and189 g/eq, available from The Dow Chemical Company; Dowanol™ PM is asolvent containing propylene glycol methyl ether, supplied by The DowChemical Company; Plenco 13943 is a phenol novolac epoxy resin,available from Plastics Engineering Co.; “A1 catalyst” is a catalystsolution of ethyltriphenylphosphonium acid acetate in methanol availablefrom Alfa Aesar; EPON™ P101 is a catalyst available from HexionChemical; “dicy” stands for dicyandiamide; “DSC” stands for DifferentialScanning calorimetry; “EEW” stands for epoxy equivalent weight; “HEW”stands for hydroxyl equivalent weight; “2-MI” stands for2-methyl-imidazole; XZ92747 is bisphenol A novolac hardener having abisphenol A content about 21% by weight, commercially available as KBEF4113 from Kolon Chemical (from Korea); XZ92755 is a bisphenol A novolachardener based on KBE F4127 has lower bisphenol A content about 17% byweight, commercially available from Kolon Chemical (from Korea); andHerinol KBE F4127 is a bisphenol A novolac hardener based on KBE F4127has lower bisphenol A content about 17% by weight, commerciallyavailable from Kolon Chemical (from Korea).

The following standard analytical equipments and methods are used in theExamples:

Epoxy equivalent weight (EEW) was measured by a colorimetric titrationof epoxy resin samples (about 0.4 mg) with 0.1 M perchloric acid in thepresence of tetraethylammonium bromide in glacial acetic acid. Crystalviolet was employed as indicator according to ASTM D 1652 method.

The glass transition temperature (Tg) was measured by DifferentialScanning calorimetry (DSC) from 50° C. to 220° C. with a heating ramp of20° C./minute.

Mechanical properties as a function of temperature were measured usingDynamic Mechanical Analysis (DMA).

The reactivity of a resin solution was measured by placing a sample ofthe resin solution on the surface of a hot plate at 170° C. Thereactivity measurement of the resin solution is reported as elapsed timein second required for gelation (“gel time”) at 170° C.

The softening point was determinate with a Mettler FP80 with a heatingramp of 3° C./minute from room temperature (about 25° C.) to 200° C.

Thermo-gravimetric Analysis (TGA) was used to measure the decompositiontemperature Td. TGA was performed by using a thermo-gravimetric analyzerTGA2950 from TA Instruments which is fitted with an auto-sampling deviceand connected to a personal computer. TGA analyzer was operated undernitrogen atmosphere. The decomposition temperature Td was measuredaccording to IPC-TM-650-2.3.40 with from 50° C. to 700° C. with aheating ramp of 10° C./minute. Td was determined at percent weight loss(except otherwise mentioned, i.e. 1%, 2%, 5%, or 10% weight loss). Thetypical experimental error was ±1° C.

Example 1 Advancement Reaction of Bisphenol Cyclododecanone with D.E.R.™330

A 66.8 gram (g) sample of bisphenol cyclododecanone (189.8 mmol) wasdissolved in 133.1 g of D.E.R.™ 330 (371.8 mmol) in a 500 ml glassreactor at 140° C. to form a solution. The solution was cooled to 80° C.and then 100 milligrams (mg) of an A1 catalyst solution (70% solids inmethanol) was added to the mixture to start the reaction of thebisphenol cyclododecanone with D.E.R. 330. The advancement reaction wascarried out at 150° C. to form Advanced Resin A. After 1 hour, theAdvanced Resin A was characterized by titration. The EEW of the AdvancedResin A obtained from the titration was 520 g/eq (EEW_(theory)=551g/eq). The Tg of the Advanced Resin A was measured by DSC with a heatingramp of 10° C./minute. The Tg was 54° C.

Comparative Example A

A 52.5 g sample of bisphenol A (230.3 mmol) was dissolved in 147.4 g ofD.E.R.™ 330 (411.7 mmol) in a 500 ml glass reactor at 140° C. Themixture was cooled to 80° C. and then 100 mg of an A1 catalyst solution(70% solids in methanol) was added to the mixture to start theadvancement reaction of bisphenol A with D.E.R. 330. The reaction wascarried out at 150° C. to form Comparative Advanced Resin A. After 1hour, the Comparative Advanced Resin A was characterized by titration.The EEW of the Comparative Advanced Resin A obtained from the titrationwas 569 g/eq (EEW_(theory)=552 g/eq). The Tg of the Comparative AdvancedResin A was measured by DSC with a heating ramp of 10° C./minute. The Tgwas 49° C.

The advanced bisphenol cyclododecanone resin (Example 1) has higherresin Tg than the advanced bisphenol A resin (Comparative Example A). Ahigher Tg for a resin can be beneficial to the resin's storagestability.

Example 2 Curing the Advanced Resin of Bisphenol Cyclododecanone andD.E.R.™ 330

A 20.0 g sample of the Advanced Resin A (EEW=520 g/eq) obtained fromExample 1 above was mixed with 0.48 g of dicy and 0.25 g of EPON™ P101.The mixture was cured for 2 hours at 200° C. to form Cured Resin A. TheTg of the Cured Resin A was measured by DSC with a heating ramp of 10°C./minute. The Tg of Cured Resin A was 141° C.

Comparative Example B

20.0 g of the Advanced Resin B (EEW=569 g/eq) obtained from ComparativeExample A above was mixed with 0.45 g of dicy (equivalent wt 14 g/eq)and 0.26 g of EPON P101.

The mixture was cured for 2 hours at 200° C. to form Cured Resin B. TheTg of Cured Resin B was measured by DSC with a heating ramp of 10°C./minute. The Tg of Cured Resin B was 115° C.

The cured resins of Example 2 and Comparative Example B show the Tg'sfor Cured Resin A (advanced bisphenol cyclododecanone resin, Example 2)and Cured Resin B (advanced bisphenol A resin, Comparative Example B)with a similar EEW. The use of the bisphenol cyclododecanone illustratesthat Cured Resin A has an increased Tg over Cured Resin B of 26° C.

Example 3 Curing the Diglycidyl Ether of Bisphenol Cyclododecanone witha Phenol Novolac

A mixture of the diglycidyl ether of bisphenol cyclododecanone (15.0 g)and a phenol novolac (5.3 g, Plenco 13943™) was mixed to insurehomogeneity and melted together at 160° C. After cooling the mixture to80° C., a solution of 2-MI (20% w/w in Dowanol™ PM, 50 mg) was added.The mixture was poured into an aluminum pan (60 mm diameter) and heatedto 200° C. for 2 hours to cure. Samples for DMA analysis with dimensions11×55×3 mm were machined from this casting. The DMA results arediscussed below.

Comparative Example C

A mixture of the D.E.R.™ 330 (15.0 g) and a phenol novolac (8.38 g,Plenco 13943™) was melted together at 160° C. After cooling the mixtureto 80° C., a solution of 2-MI (20% w/w in Dowanol™ PM, 50 mg) was added.The mixture was poured into an aluminum pan (60 mm diameter) and heatedto 200° C. for 2 hours to cure. Samples for DMA analysis with dimensions11×55×3 mm were machined from this casting. The DMA results arediscussed below.

The toughness of two resins (Resin C and Comparative Resin C) wasmeasured by DMA. The cured resin of Example 2 which comprises Resin C isan advanced bisphenol cyclododecanone resin prepared using the procedurein Example 1. Resin C was cured with Plenco 13943 using the procedure inExample 2. The cured resin is referred to herein as “Cured Resin C”(Example 3).

Comparative Resin C is a conventional bisphenol A, DER 330. ComparativeResin C was cured with Plenco 13943 [herein “Comparative Cured Resin C”(Comparative Example C)] using the procedure of Comparative Example B.

Cured Resin C and Comparative Cured Resin C have similar glasstransition temperature (Tg) at about 130° C. The toughness of the abovetwo resins can be compared because the resins have similar glasstransition temperatures (Tg).

Toughness may be defined by a drop in Young's modulus (E′). The tworesins get less stiff (modulus decreases) as a result of the glasstransition at about 130° C. The Young's modulus (E′) of Cured Resin Cdecreases from about 5×10⁹ Pa before the Tg at 130° C. to about 3×10⁷ Paafter the Tg at 130° C.

The Young's modulus (E′) of Cured Resin C in the rubber modulus range(after Tg reaches 130° C.) has a lower Young's modulus (E′) (improvedtoughness) than that of Comparative Cured Resin C in the same rubbermodulus range. Accordingly, Cured Resin C has an improved toughness byusing bisphenol cyclododecanone over Comparative Cured Resin C whichuses a conventional bisphenol A.

The results of Examples of the present invention show that an epoxyresin comprising a diglycidyl ether of a dihydroxydiphenyl-cycloalkanecompound has a higher resin glass transition temperature (resin Tg) thana conventional epoxy resin such as those based on bisphenol A (seeExample 1 and Comparative Example A). The cured epoxy resin of thepresent invention shows a higher cured glass transition temperature(cured Tg) than an epoxy resin comprising a conventional epoxy resinbased on bisphenol A (see Example 2 and Comparative Example B). Thecured epoxy resin of the present invention also has improved mechanicalproperties such as toughness compared to a conventional epoxy resincured by phenolic hardeners; and therefore, the epoxy resin of thepresent invention has improved resistance to impact (see Example 3 andComparative Example C).

Example 4 Synthesis of eCDON

A two liter, three necks, round bottom glass reactor equipped with athermostatically controlled heating mantle was charged with thebisphenol of cyclododecanone (˜176 g, 1.0 hydroxyl eq), epichlorohydrin(˜694 g, 7.5 moles) and isopropanol (˜373 g, 35% weight of theepichlorohydrin used). The reactor was additionally equipped with acondenser (maintained at −15° C.), a thermometer, a Claisen adaptor, anoverhead nitrogen inlet (1 LPM N₂ used), and a stirrer assembly (Teflon™paddle, glass shaft, variable speed motor). After dissolving at 50° C.,a solution of sodium hydroxide (20% in water, 180 g) was added to a sidearm vented addition funnel over 20-30 minutes. Stirring commenced togive slurry of the bisphenol of cyclododecanone in epichlorohydrin andisopropanol. The temperature was maintained at 50° C. during thereaction. After 20 minutes of postreaction, stirring was stopped and theaqueous layer was removed from the organic layer.

Heating and stirring of the organic layer was resumed to 50° C. Dropwiseaddition of a second portion of sodium hydroxide (20% in water, 80 g) tothe organic layer was completed over 20 minutes while maintaining thetemperature at 50° C. After 20 minutes of postreaction stirring wasstopped, and the aqueous layer was removed from the organic layerproduct. Then the organic layer was washed with 3-4 portions (250milliliters each) of deionized water until a pH of 7 of the organiclayer was achieved.

Rotary evaporation of the organic layer using an oil bath temperature of75° C. was used to remove the bulk of the volatiles. Further rotaryevaporation at 125° C. for 2-3 hour (16 mbar) gave ˜225-235 g oftransparent, colorless liquid which solidified to a brittle solid atroom temperature (˜25° C.). The resulting resin was the diglycidyl etherof bisphenol cyclododecanone (herein “eCDON”) and had the followingproperties:

EEW Softening Melt viscosity at measured by Tg Point 150° C. titrationExample 4 Resin (° C.)¹ (° C.)² (mPa · s) (g/eq) eCDON 31 74.6 120 236¹From −20° C. to 150° C. with 10° C./minute ²At 2° C./minute

Example 5 Preparation of a Powder Composition Using eCDON

A 20 g sample of the eCDON (EEW 236 g/eq) prepared in Example 4 above,1.06 g dicy (equiv. wt. 14 g/mol) and 0.35 g EPON™ P101 were mixed 10seconds at 15° C. to a fine powder. The powder was than cured for 30minutes at 200° C. The glass transition temperature (Tg) of theresulting thermoset was recorded from 50° C. to 300° C. with a heat rampof 10° C./minute. The Tg of the resulting thermoset was about 198° C.

Comparative Example E Preparation of a Powder Composition Using aConventional Epoxy Resin

A 20 g sample of an epoxy resin D.E.R.™ 330 (EEW 179 g/eq) (a diglycidylether of bisphenol A material, commercially available from The DowChemical Company), 1.4 g dicy (equiv. wt. 14 g/eq) and 0.35 g EPON™ P101were mixed at 120° C. and 20 minutes at 180° C. The resulting productwas mixed 10 seconds at 150° C. to a fine powder which was than curedfor 30 minutes at 200° C. The Tg of the resulting product was recordedfrom 50° C. to 300° C. with a heat ramp of 10° C./minute. The Tg of theresulting thermoset was about 143° C.

As shown in the above Example 5 and Comparative Example E, the use ofthe advanced diglycidyl ether of bisphenol cyclododecanone (Example 1)as compared to the use of the diglycidyl ether of bisphenol A material(Comparative Example E) resulted in a thermoset product with a Tg of198° C. versus 143° C., respectively. The use of the diglycidyl ether ofbisphenol cyclododecanone increased the Tg of the resulting thermosetproduct by 55° C.

Example 6 Cure of eCDON with Dicy

A sample of eCDON (4.62 g), dicy (0.34 g), and 2-phenylimidazole (0.038g) was mixed by cryogrinding. This procedure involves adding the solidsto a stainless steel cylinder with threaded ends, adding a metal ball,cooling the contents in liquid nitrogen, and shaking the assembly for 10minutes. The cylinder was placed in a nitrogen-purged bag and allowed towarm to room temperature. A portion of the powder was placed in analuminum pan, and heated in a vacuum oven at 190° C. for 90 minutes toform a clear casting. A Tg of 202° C. was observed by DSC. This castingwas cut into 4 pieces, each was weighed, and all were placed in a steamautoclave at 121° C. for 90 minutes. The weight gain of each piece wasexpressed as a percentage, and the 4 values were averaged to give avalue of 2.3 wt %.

Comparative Example F Cure of D.E.R.™ 331 with Dicy

The experiment described in Example 6 was repeated using D.E.R.™ 331(bisphenol A diglycidyl ether, 4.51 g), dicy (0.44 g), and2-phenylimidazole (0.05 g). A Tg of 139° C. was observed by DSC, and thewater absorption was 3.9 wt %.

As shown in the above Example 6 and Comparative Example F, the use ofthe diglycidyl ether of bisphenol cyclododecanone (Example 6) ascompared to the use of the diglycidyl ether of bisphenol A material(Comparative Example F) resulted in a thermoset product with a Tg 202°C. versus 139° C., respectively and water absorption of 2.3 wt % versus3.9 wt %, respectively. The use of the diglycidyl ether of bisphenolcyclododecanone increased the Tg of the resulting thermoset product by63° C. and reduced water absorption by 41%.

The invention claimed is:
 1. A process for forming a curable powdercoating resin comprising: admixing (I) at least one thermoset resincomposition; and (II) at least one hardener, wherein the thermoset resincomposition comprises an epoxy resin represented by the followinggeneral Formula I:

R^(a) is a hydrogen or methyl group; R¹ and R², independently from eachother, each represents a hydrogen atom, a halogen, a substituted orunsubstituted alkyl group, a substituted or unsubstituted aryl group, ora substituted or unsubstituted aralkyl group; a nitrile group; a nitrogroup; a substituted or unsubstituted alkoxy group; X is a carbon atom;m is an integral number between 11 and 20; R³ and R⁴, independently fromeach other, each represents a hydrogen atom, a halogen, a substituted orunsubstituted alkyl group, a substituted or unsubstituted aryl group, ora substituted or unsubstituted aralkyl group; and n is an integer havinga value from 1 to
 10. 2. The process of claim 1, wherein the admixingcomprises grinding to form a ground mixture.
 3. The process of claim 2,further including extruding the ground mixture to form an extrudate. 4.The process of claim 3, further including flaking the extrudate.
 5. Theprocess of claim 1, further including admixing an additionalthermosetting resin component (Ill) selected from epoxy resins,isocyanate resins, (meth)acrylic resins, phenolic resins, vinylicresins, styrenic resins, polyester resins, and mixtures thereof with the(I) at least one thermoset resin composition and the (II) at least onehardener.
 6. The process of claim 5, wherein the additionalthermosetting resin (Ill) comprises an epoxy resin.
 7. The process ofclaim 1, wherein the admixing includes the (I) at least one thermosetresin composition from about 10 percent by weight to about 99 percent byweight of the total weight of the components.
 8. The process of claim 1,further including admixing at least one of: (V) a catalyst; and (VI) asolvent.
 9. The process of claim 1, wherein the (I) at least onethermoset resin composition comprises a diglycidyl ether of adihydroxydiphenyl-cycloalkane compound; and wherein thedihydroxydiphenyl-cycloalkane compound comprises adihydroxydiphenyl-cycloalkane compound represented by the followinggeneral Formula IV:

wherein R¹ and R², independently from each other, each represents ahydrogen atom, a halogen, a substituted or unsubstituted alkyl group, asubstituted or unsubstituted aryl group, or a substituted orunsubstituted aralkyl group; X is a carbon atom; m is an integral numberbetween 11 and 20; and R³ and R⁴, independently from each other, eachrepresents a hydrogen atom, a halogen, a substituted or unsubstitutedalkyl group, a substituted or unsubstituted aryl group, or a substitutedor unsubstituted aralkyl group.
 10. The process of claim 9, wherein thedihydroxydiphenyl-cycloalkane compound is made from a compound thatcomprises cyclododecanone, cyclopentadecanone, cyclooctadecanone,cycloeicosanone, and mixtures thereof.
 11. The process of claim 1,wherein the (I) at least one thermoset resin composition is advancedwith bisphenol cyclododecanone.
 12. The process of claim 1, wherein the(I) at least one thermoset resin composition comprises from about 20percent by weight to about 98 percent by weight based on total weight ofthe composition; and wherein component (II) comprises from about 2percent by weight to about 50 percent by weight based on total weight ofthe composition.